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马学鸣 , 岳兰平 , 董远达
金属学报
本文研究了室温下氧化铜用金属镁作还原剂的机械还原.电镜和X射线衍射结果都表明,室温下球磨32h后,CuO基本被还原.还原后晶粒细化到平均尺寸小于20nm,由此提出了机械力驱动下,纳米级界面激活的机械还原机制。
关键词: CuO , Cu , mechanical reduction , Mg
MA Xueming YUE Lanping DONG Yuanda Institute of Solid State Physics , Academia Sinica , Hefei , China
金属学报(英文版)
The mechanical reduction of CuO by pure metallic Mg has been investigated during pulver- izing in ball mill at room temperature.The reduction was towards its completion of an average particle size down to 20 nm after milling for 32 h.The mechanism of the mechanical reduction of oxides seems to be the surface activation of nano-metre sized particles driven by mechani- cal force.
关键词: CuO , null , null , null
